Adhesive sheets
US4756968A · kind A · utility
47Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1986 |
| Grant date | Jul 12, 1988 |
| Priority date | — |
| Expiry date | Nov 18, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2809
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, said compound being a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chip as picked up.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.