Kazuyoshi Ebe
28Patents
14h-index
25Co-inventors
77Inventor score
Filing activity: Nov 18, 1986 → Jun 18, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5882956A | Process for producing semiconductor device | Electricity | 99 | Expired |
| US5110388A | Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape | Emerging Cross-Sectional Technologies | 87 | Expired |
| US5118567A | Adhesive tape and use thereof | Emerging Cross-Sectional Technologies | 57 | Expired |
| US4756968A | Adhesive sheets | Emerging Cross-Sectional Technologies | 47 | Expired |
| US6398892B1 | Method of using pressure sensitive adhesive double coated sheet | Emerging Cross-Sectional Technologies | 46 | Expired |
| US6007920A | Wafer dicing/bonding sheet and process for producing semiconductor device | Emerging Cross-Sectional Technologies | 43 | Expired |
| US5356949A | Adhesive composition comprising (meth)acrylate polymer and epoxy resin | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5187007A | Adhesive sheets | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6465330B1 | Method for grinding a wafer back | Emerging Cross-Sectional Technologies | 30 | Expired |
| US4946728A | Adhesive paper for copying | Emerging Cross-Sectional Technologies | 26 | Expired |
| US5976691A | Process for producing chip and pressure sensitive adhesive sheet for said process | Emerging Cross-Sectional Technologies | 24 | Expired |
| US4965127A | Adhesive sheets | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6225194A | Process for producing chip and pressure sensitive adhesive sheet for said process | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6702910B2 | Process for producing a chip | Emerging Cross-Sectional Technologies | 21 | Expired |
| US4929486A | Cover tape for sealing chip-holding parts of carrier tape | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6312800A | Pressure sensitive adhesive sheet for producing a chip | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6977024B2 | Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6436795B1 | Process for producing semiconductor chip | Electricity | 12 | Expired |
| US6297076A | Process for preparing a semiconductor wafer | Electricity | 11 | Expired |
| US6139953A | Adhesive tape, base material for adhesive tape and their manufacturing methods | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6171672A | Cover tape for chip transportation and sealed structure | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6718223B1 | Method of processing semiconductor wafer and semiconductor wafer supporting member | Electricity | 8 | Expired |
| US6911720B2 | Semiconductor device adhesive sheet with conductor bodies buried therein | Emerging Cross-Sectional Technologies | 5 | Expired |
| US4994300A | Method of making a cover tape for sealing chip-holding parts of carrier tape | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6156423A | Base material and adhesive tape using the same | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.