Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs
US4761518A · kind A · utility
61Cited by
3References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1987 |
| Grant date | Aug 2, 1988 |
| Priority date | — |
| Expiry date | Jan 20, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises forming a four-sided semiconductor casing having a leadframe with an aluminum cladding that is etched away at the ends extending from the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.