Process of producing plastic-molded printed circuit boards
US4764327A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1987 |
| Grant date | Aug 16, 1988 |
| Priority date | — |
| Expiry date | Jan 14, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09118
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin composition, and a hard pin mold III having hard pins for forming holes fixed thereto in such a manner that PA0 (a) the mold I is fixed to the fixed side metal platen, the mold II…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.