Mitsuru Nozaki
9Patents
5h-index
24Co-inventors
63Inventor score
Filing activity: Jan 14, 1987 → Aug 19, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4740343A | Method for producing rigid resin molds | Electricity | 22 | Expired |
| US4764327A | Process of producing plastic-molded printed circuit boards | Electricity | 13 | Expired |
| US5186880A | Process for producing cyanate ester resin cure product | Chemistry; Metallurgy | 10 | Expired |
| US5692940A | Sheet material for laminate of printed circuit and laminate for printed circuit using the same | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7192651B2 | Resin composition and prepreg for laminate and metal-clad laminate | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7989081B2 | Resin composite copper foil, printed wiring board, and production processes thereof | Emerging Cross-Sectional Technologies | 3 | Active |
| US6229096A | Nonwoven reinforcement for printed wiring base board and process for producing the same | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7892651B2 | Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9949371B2 | Resin composite electrolytic copper foil, copper clad laminate and printed wiring board | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.