Bonding of pure metal films to ceramics
US4764341A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1987 |
| Grant date | Aug 16, 1988 |
| Priority date | — |
| Expiry date | Apr 27, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31536
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The bonding of nickel, cobalt, copper or any number of metals to oxide ceramics is achieved whereby the substrate and associated metallurgy are co-sintered. The invention teaches the use of an intermediary oxide such as Al2O3, Cr2O3, TiO2 or ZrO2 which will adhere to the substrate and in the presence of firing ambients form a complex ternary oxide with the overlying metal thereby creating the desired bond. The eutectic can be created during the firing cycle without the undesired consequence of oxidizing the metal. The so-called intermediary oxides can be oxidized in situ, deposited as oxides, or introduced into either the ceramic composition or the metal paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.