Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor
US4769345A · kind A · utility
71Cited by
22References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1987 |
| Grant date | Sep 6, 1988 |
| Priority date | — |
| Expiry date | Mar 12, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to a process of forming a package for enclosing an electrical device wherein the enclosure contains a very low amount of oxygen and water vapor. The package includes a base and lid components bonded together by a sealing glass. The lid component contains a gettering alloy from which the oxide layer is removed prior to the final sealing of the package. The gettering alloy forms a refractory oxide layer under an oxide layer formed with the primary constituent of the alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.