Laser processing apparatus
US4769523A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1987 |
| Grant date | Sep 6, 1988 |
| Priority date | — |
| Expiry date | Jan 9, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus for projecting a spot of laser beam onto a portion of a microcircuit pattern on a semiconductor wafer, photographic mask or the like to cut the lead or anneal the limited area. The laser processing apparatus includes a mark detector for detecting the positions of first marks preliminarily provided on a work as the relative positions to the detection centers of the mark detector itself, a controller for controlling a processing energy beam generator so as to form on the work second marks detectable by the mark detector, and an error detector responsive to the results of the position detection of the second marks by the mark detector so as to detect relative positional errors between the focussing centers of the energy beam on the work and the detection centers of the mark detector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.