Apparatus and method for inspecting soldered portions
US4772125A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1986 |
| Grant date | Sep 20, 1988 |
| Priority date | — |
| Expiry date | Jun 19, 2006 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.