Inter-ply adhesion between saran and linear ethylene copolymers
US4778715A · kind A · utility
3Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1987 |
| Grant date | Oct 18, 1988 |
| Priority date | — |
| Expiry date | Jun 24, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are multi-layer films having improved adhesion between layers. A film layer comprising vinylidene chloride copolymer is directly adhered to a film layer comprising a blend of ethylene/butyl-acrylate copolymer with linear ethylene/alpha-olefin copolymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.