Daniel J. Ferguson
11Patents
6h-index
12Co-inventors
63Inventor score
Filing activity: Nov 27, 1981 → Sep 17, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4640856A | Multi-layer packaging film and receptacles made therefrom | Emerging Cross-Sectional Technologies | 81 | Expired |
| US4755403A | Protective patch for shrinkable bag | Emerging Cross-Sectional Technologies | 71 | Expired |
| US4390385A | Heat sealable, multi-ply polypropylene film | Emerging Cross-Sectional Technologies | 34 | Expired |
| US5234731A | Thermoplastic multi-layer packaging film and bags made therefrom having two layers of very low density polyethylene | Emerging Cross-Sectional Technologies | 27 | Expired |
| US4765857A | Protective patch for shrinkable bag | Performing Operations; Transporting | 26 | Expired |
| US4770731A | Method of making a patch for a shrinkable bag | Performing Operations; Transporting | 26 | Expired |
| US5471033A | Process and apparatus for contamination-free processing of semiconductor parts | Chemistry; Metallurgy | 4 | Expired |
| US4778715A | Inter-ply adhesion between saran and linear ethylene copolymers | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5550351A | Process and apparatus for contamination-free processing of semiconductor parts | Chemistry; Metallurgy | 1 | Expired |
| US11505777B2 | Biological processing assembly | Performing Operations; Transporting | 0 | Active |
| US5587095A | Process and apparatus for contamination-free processing of semiconductor parts | Chemistry; Metallurgy | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.