Hybrid integrated circuit substrate and method of manufacturing the same
US4783642A · kind A · utility
8Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 1987 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | May 13, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49099
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hybrid integrated circuit substrate contains an insulating substrate. On predetermined positions of the upper surface of the substrate, there are formed resistors and activation layers to be in contact with ends of the resistors. On predetermined positions of the upper surfaces of the activation layers, there are formed conductor layers electrically connected with the ends of the resistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.