Method of making a hermetically sealed semiconductor casing
US4784974A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 1986 |
| Grant date | Nov 15, 1988 |
| Priority date | — |
| Expiry date | Oct 31, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12611
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved hermetically sealed semiconductor casing and a process for producing the casing are disclosed. This casing includes a lead frame having an electrical device affixed thereto. A base member is glass bonded to a matching surface of the lead frame. A metal window frame shaped device is provided having one surface with a refractory oxide coating and a second opposite readily solderable surface. The refractory oxide layer of the window frame device is glass bonded to the lead frame and the base member. The semiconductor or electrical device is connected to the lead frame after the window frame has been glass bonded into place. A metal lid having a solderable surface is solder bonded to the solderable surface of the window frame to hermetically seal the electrical device within the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.