Method of measuring inclining angle of planar defect of solid material by ultrasonic wave
US4785667A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1987 |
| Grant date | Nov 22, 1988 |
| Priority date | — |
| Expiry date | Feb 11, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2632
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of measuring the inclining angle of a planar defect of a solid material with ultrasonic waves which includes the steps of irradiating ultrasonic waves incident to the planar defect of a solid material while longitudinally scanning a probe forwardly and backwardly. The inclining angle of the planar defect is determined based on the inclination of an echo envelope obtained from the relationship of the echo beam path distances of the ultrasonic waves versus the echo amplitudes or heights of the reflected waves reflected from the planar defect of the solid material. The inclining angle of the defect corresponds to a straight line portion of the echo envelope in a region where the echo height decreased gradually from a maximum height position as the echo beam path distance increases. Measurements can be made non-destructively with one probe and the inclining angle of the planar defect generated within an element or a member forming part of an electronic or mechanical apparatus can be determined accurately in an extremely efficient manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.