Duplex glass preforms for hermetic glass-to-metal compression sealing
US4788382A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 1987 |
| Grant date | Nov 29, 1988 |
| Priority date | — |
| Expiry date | May 18, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A duplex glass preform for forming hermetic glass-to-metal seals of the compression type. The duplex glass preform comprises a glass infrasturcture or matrix having at least one end thereof modified by the selective distribution therein of ceramic particles. The ceramic particles are selectively distributed to form a ceramic density gradient having the largest concentration of ceramic particles at the surface and gradually decreasing with depth. The duplex glass preform of the present invention has utility in forming glass-to-metal compression seals in hybrid metal packages containing microcircuit chips. The duplex glass preform may be used in the normal insulative fashion or as a conductive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.