Direct wafer temperature control
US4788416A · kind A · utility
6Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1987 |
| Grant date | Nov 29, 1988 |
| Priority date | — |
| Expiry date | Mar 2, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/143
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The temperature of a wafer in a vacuum chamber is measured by way of a tube, containing a thermocouple, extending through a wall of the chamber. The tube is sealed at one end to an aperture in the wall of the system and sealed at the other end with removable sealant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.