Semiconductor device and method of producing semiconductor device
US4788583A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 24, 1987 |
| Grant date | Nov 29, 1988 |
| Priority date | — |
| Expiry date | Jul 24, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has such a construction that free tip ends of stage bars extending from a stage do not extend to side surfaces of a resin package, and the resin package is constituted by an inner resin package portion and an outer resin package portion. The free tip ends of the stage bars are located inside the outer resin package portion and are completely sealed. A method of producing the semiconductor device includes steps of providing wires for electrically connecting terminals of a semiconductor element which is mounted on the stage with corresponding leads and forming the inner resin package portion over the semiconductor element and its vicinity including portions of the leads and stage bars which are connected to the stage. Then the free tip ends of the stage bars are cut and the outer resin package portion is formed over the inner resin package portion and the remaining portion of the semiconductor device, so that the cut free tip ends of the stage bars are completely sealed inside the outer resin package portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.