Chemical copper-blating bath
US4790876A · kind A · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1987 |
| Grant date | Dec 13, 1988 |
| Priority date | — |
| Expiry date | Jul 1, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a chemical copper-plating bath comprising a copper sulfate, a complexing agent, a reducing agent, and a pH-adjusting agent, borofluoride is added to enhance the deposition speed of Cu, thus eliminating the problems of a complicated control of the bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.