Inventor · Okazaki, JP

Kaoru Nomoto

10Patents
6h-index
24Co-inventors
62Inventor score

Filing activity: Oct 8, 1985 → Feb 6, 2001

Most-cited inventions

PatentTitleAreaCited byStatus
US6274821A Shock-resistive printed circuit board and electronic device including the same Emerging Cross-Sectional Technologies 140 Expired
US5248853A Semiconductor element-mounting printed board Electricity 29 Expired
US6228467A Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate Emerging Cross-Sectional Technologies 25 Expired
US4834796A Electroless copper plating solution and process for electrolessly plating copper Chemistry; Metallurgy 13 Expired
US6499217B1 Method of manufacturing three-dimensional printed wiring board Emerging Cross-Sectional Technologies 10 Expired
US4956014A Electroless copper plating solution Chemistry; Metallurgy 6 Expired
US4935267A Process for electrolessly plating copper and plating solution therefor Chemistry; Metallurgy 6 Expired
US4814009A Electroless copper plating solution Chemistry; Metallurgy 4 Expired
US4656195A Ethylene oxide adducts, method of producing same and cosmetics and ointments containing same Human Necessities 2 Expired
US4790876A Chemical copper-blating bath Chemistry; Metallurgy 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.