High-density wired circuit board using insulated wires
US4791238A · kind A · utility
15Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1987 |
| Grant date | Dec 13, 1988 |
| Priority date | — |
| Expiry date | Mar 31, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high-density wired circuit board obtained by providing an auxiliary grid at the position of centroid of a main grid and by employing wiring in the inclined direction mainly instead of wiring in the XY directions mainly can make the space between wires and through-holes large without narrowing a wiring pitch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.