Inventor · Chikusei, JP

Yorio Iwasaki

12Patents
8h-index
38Co-inventors
72Inventor score

Filing activity: May 12, 1978 → Mar 31, 2000

Most-cited inventions

PatentTitleAreaCited byStatus
US6064111A Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Electricity 46 Expired
US5309632A Process for producing printed wiring board Emerging Cross-Sectional Technologies 38 Expired
US4216246A Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards Electricity 37 Expired
US5929741A Current protector Electricity 32 Expired
US4791238A High-density wired circuit board using insulated wires Emerging Cross-Sectional Technologies 15 Expired
US6236108A Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Electricity 13 Expired
US5233133A Coaxial conductor interconnection wiring board Emerging Cross-Sectional Technologies 11 Expired
US5323534A Process for producing coaxial conductor interconnection wiring board Emerging Cross-Sectional Technologies 9 Expired
US5584121A Process for producing multiple wire wiring board Emerging Cross-Sectional Technologies 8 Expired
US5403869A Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator Emerging Cross-Sectional Technologies 8 Expired
US5486655A Multiple wire adhesive on a multiple wire wiring board Emerging Cross-Sectional Technologies 8 Expired
US5053280A Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent Emerging Cross-Sectional Technologies 6 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.