Lead frame and semiconductor device using the same
US4791472A · kind A · utility
12Cited by
1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 1988 |
| Grant date | Dec 13, 1988 |
| Priority date | — |
| Expiry date | Feb 9, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32245
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin encapsulated type semiconductor device is manufactured by using a lead frame in which a stress relaxation portion is formed near the connection portion between the tab suspending the lead and the tab according to this invention, whereby stress concentration to the tab at the connection portion of the tab suspending lead can be prevented even when the tab as the pellet mounting portion is thermally expanded thereby preventing crackings from resulting in the semiconductor pellets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.