Thin film magnetic head having Au ultrasonic connection structure
US4796132A · kind A · utility
11Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1987 |
| Grant date | Jan 3, 1989 |
| Priority date | — |
| Expiry date | Oct 22, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0285
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Conductor film terminals of a thin film magnetic head are composed of an Au film while lead terminals of a flexible printed circuit board are covered with an Au layer, so that both of these terminals can be bonded by low temperature ultrasonic bonding directly between Au and Au. The reverse surface of the lead terminals of the flexible printed circuit board is bonded and fixed to a flexible polymer resin cover film so that the dimensional accuracy of the bonded terminal portion can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.