Tokiyuki Seto
3Patents
3h-index
9Co-inventors
39Inventor score
Filing activity: Oct 22, 1987 → Jan 22, 1993
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5431324A | Ultrasonic bonding apparatus and quality monitoring method | Electricity | 32 | Expired |
| US5323952A | Bonding apparatus and testing apparatus of a bonded portion | Electricity | 25 | Expired |
| US4796132A | Thin film magnetic head having Au ultrasonic connection structure | Electricity | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.