Method for producing a plurality of layers of metallurgy
US4805683A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1988 |
| Grant date | Feb 21, 1989 |
| Priority date | — |
| Expiry date | Mar 4, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/951
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for selectively depositing a plurality of metal layers on a substrate. The method includes the steps of depositing at least one layer of blanket metal on a surface of a substrate, building a lift-off stencil over the blanket metal, depositing at least one layer of redundant metal over the lift-off stencil, depositing a first etch-resistant barrier over the redundant metal, removing the lift-off stencil and the overlying layers of redundant metal and the etch-resistant barrier, depositing a second etch-resistant barrier over the blanket metal and the first etch-resistant barrier, and then reactive ion etching (RIE) the second etch-resistant barrier so as to expose the blanket metal and at least partially remove the second etch-resistant barrier from the first etch-resistant barrier. A final step of the method includes etching the blanket metal. Also disclosed is a metallurgical structure for a packaging substrate. The metallurgical structure includes layers of blanket metal and redundant metal. The redundant metal has an electrically isolating coating on its side but not on its top surface, thereby facilitating the electrical contact of the redundant metal with an electrica…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.