Method for manufacture of printed circuit boards
US4806200A · kind A · utility
14Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1987 |
| Grant date | Feb 21, 1989 |
| Priority date | — |
| Expiry date | Dec 14, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of preparing printed circuit boards is described in which the solder mask is applied over a thin layer of copper oxide covering the copper circuit traces, the copper oxide layer being that which remains after stripping the tin or tin-lead alloy etch resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.