Method and package for dissipating heat generated by an integrated circuit chip
US4807018A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 26, 1987 |
| Grant date | Feb 21, 1989 |
| Priority date | — |
| Expiry date | Oct 26, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package having a semiconductor integrated circuit chip thermally and mechanically coupled to a cooling plate is described. The leadframe conductors for the package have bent end portions to bring the conductors in close proximity to the integrated circuit chip. The bent end portions of the leadframe conductors are coated with an electrically insulating material such as a varnish comprising a Teflon-based lacquer with suitable high temperature properties for permitting mechanical and thermal contact of the leadframe conductors to the heat sink or the cooling plate without electrical connection thereto. One of the leadframe conductors is adapted to engage an aperture in the cooling plate to provide a positioning mechanism and increased mechanical connection between the leadframe conductors and the cooling plate. By configuring the leadframe in an appropriate manner, conducting wires can be coupled to the chip on three sides thereof from the bent end portions of the leadframe conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.