Chlorine-containing resin molding and material for use therewith
US4808642A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1986 |
| Grant date | Feb 28, 1989 |
| Priority date | — |
| Expiry date | Apr 25, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a chlorine-containing resin molding characterized by its stabilization by aminocarboxylic acid and from which molding substantially no metallic ion is detected, and to material for use with the chlorine-containing resin molding consisting of 100 parts by weight of chlorine-containing resin and 0.5-5.0 parts by weight of aminocarbolyxic acid. According to the molding and the material for use therewith, there is no possibility of metallic ion dissolving from the molding in which a metallic stabilizer is conventionally used, with the result that the molding finds wide application in the industrial field related with electric parts including a semiconductor as a main item, medical treatment, chemicals and pharmaceuticals, and food stuffs, all subject to adverse effects by dissolution of metallic ion. Consideration for application of a nonmetallic agent is also given to the use of a coloring agent and a lubricant with respect to the molding and the material for use therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.