Hideki Kitada
31Patents
8h-index
31Co-inventors
75Inventor score
Filing activity: Apr 25, 1986 → Oct 22, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6242808A | Semiconductor device with copper wiring and semiconductor device manufacturing method | Electricity | 52 | Expired |
| US7507666B2 | Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition | Electricity | 27 | Active |
| US6257561A | Air spring | Performing Operations; Transporting | 18 | Expired |
| US7416985B2 | Semiconductor device having a multilayer interconnection structure and fabrication method thereof | Electricity | 18 | Expired |
| US8319277B2 | Semiconductor device, method of manufacturing same, and apparatus for designing same | Electricity | 16 | Active |
| US7670925B2 | Semiconductor device, method of manufacturing same, and apparatus for designing same | Electricity | 16 | Active |
| US7611984B2 | Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy | Electricity | 10 | Active |
| US7413977B2 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Electricity | 9 | Active |
| US7868456B2 | Semiconductor device and method for fabricating the same | Emerging Cross-Sectional Technologies | 8 | Active |
| US8540220B2 | Air spring for vehicle and railway truck for vehicle | Mechanical Engineering; Lighting; Heating | 7 | Active |
| US8071474B2 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Electricity | 4 | Active |
| US7846833B2 | Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device | Electricity | 4 | Active |
| US7795141B2 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Electricity | 4 | Active |
| US7205667B2 | Semiconductor device having copper wiring | Electricity | 3 | Expired |
| US7713869B2 | Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device | Electricity | 3 | Expired |
| US7329952B2 | Method of fabricating a semiconductor device | Electricity | 2 | Expired |
| US9202752B2 | Semiconductor device with first and second semiconductor substrates | Electricity | 2 | Active |
| US4808642A | Chlorine-containing resin molding and material for use therewith | Chemistry; Metallurgy | 1 | Expired |
| US7279790B2 | Semiconductor device and a manufacturing method thereof | Electricity | 1 | Expired |
| US10435044B2 | Air spring and bogie | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US10563719B2 | Air spring and bogie | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US7871924B2 | Semiconductor device having copper wiring | Electricity | 1 | Active |
| US10449979B2 | Air spring and bogie | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US10538257B2 | Air spring and bogie | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US10597050B2 | Air spring and bogie | Mechanical Engineering; Lighting; Heating | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.