Semiconductor device
US4808844A · kind A · utility
28Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1987 |
| Grant date | Feb 28, 1989 |
| Priority date | — |
| Expiry date | Apr 1, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device formed on a semiconductor chip (1) comprises a plurality of first bonding pads (3a, 3d) for receiving an identical external signal, an internal circuit (8) connected to any one of the plurality of the first bonding pads, a second bonding pad (11) for receiving a control signal from outside the semiconductor chip, and a bonding pad selection switch (19) for selecting a bonding pad out of the plurality of first bonding pads and connecting it to the internal circuit in response to the control signal supplied thereto through the second bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.