Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
US4810326A · kind A · utility
18Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1987 |
| Grant date | Mar 7, 1989 |
| Priority date | — |
| Expiry date | Aug 31, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a fluorohydrocarbon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.