Process for sharpening cutting-off tools and cutting-off process

US4811722A · kind A · utility

Assignee

• Wacker Chemitronics GmbH · DE

Inventors

• Gerhard Brehm · Emmerting, DE
• Johann Niedermeier · Burghausen, DE

Key dates

• Filing date: May 5, 1988
• Grant date: Mar 14, 1989
• Expiry date: May 5, 2008

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B53/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Cutting-off tools whose cutting edge has a cutting layer with a bonded cutting grain are sharpened by sawing momentarily into a solid sharpening substance, in which case, in addition to a relative movement between cutting edge and solid material corresponding to the sawing operation, an oscillating relative movement transversely thereto is also performed. The process is used with particular advantage in combination with processes for the centerhole sawing of semiconductor or oxidic material.