Electroless copper plating solution
US4814009A · kind A · utility
4Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1987 |
| Grant date | Mar 21, 1989 |
| Priority date | — |
| Expiry date | Nov 13, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methyl-piperidine, and tris (4-bromophenyl) amine, N-methylmorpholine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.