Plating bath composition for copper-tin-zinc alloy
US4814049A · kind A · utility
28Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1986 |
| Grant date | Mar 21, 1989 |
| Priority date | — |
| Expiry date | May 21, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/58
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An alkaline, cyanide, aqueous electroplating composition of copper, tin, and zinc includes a small amount of nickel to enhance the inclusion of tin in the copper-tin-zinc plate deposited from the soltion. The plate resists tarnishing by a corrosion test solution, and retains its bright silvery-colored appearance because the plate preferably includes at least about 10.9 atomic wt % tin. The plating method for enhanced tin alloys through nickel additions to the bath is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.