Thermal processing of photoresist materials
US4814243A · kind A · utility
20Cited by
7References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 8, 1987 |
| Grant date | Mar 21, 1989 |
| Priority date | — |
| Expiry date | Sep 8, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/265
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In an image reversal process (12), a photoresist coating on a wafer is baked in an oven (19) in the presence of amine gas to fix the exposed photoresist portion (14). A computer (21) is programmed with a characterization of the photoresist film. The output of a temperature sensing element (23) mounted on the wafer is directed to the computer which, in response, controls introduction of the amine gas and withdrawal of the wafer after a predetermined extent of reaction in the coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.