Process for producing ceramic substrates for microelectronic circuits
US4817276A · kind A · utility
5Cited by
5References
4Claims
0Family size
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Key dates
| Filing date | Apr 2, 1986 |
| Grant date | Apr 4, 1989 |
| Priority date | — |
| Expiry date | Apr 2, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A ceramic substrate for densely integrated semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite crystals and a non-crystalline binder composed of SiO.sub.2, Al.sub.2 O.sub.3, and MgO, is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.