Processing apparatus
US4818326A · kind A · utility
84Cited by
19References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1988 |
| Grant date | Apr 4, 1989 |
| Priority date | — |
| Expiry date | Apr 26, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing apparatus and method for providing a process module with a low pressure, low energy ion implanter and a remote microwave plasma generator and a source of thermal energy, which is adapted to receive wafers for processing in a low pressure carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.