Thin film deposition apparatus and method
US4818561A · kind A · utility
7Cited by
0References
33Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 6, 1987 |
| Grant date | Apr 4, 1989 |
| Priority date | — |
| Expiry date | May 6, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and method for the deposition of a thin metal film on a surface of a workpiece as the workpiece is positioned adjacent to a deposition source and as the workpiece and deposition source rotate relative to each other about a first axis. The workpiece can also be moved relative to the deposition source about a second axis as the workpiece and the deposition source rotate relative to each other about the first axis. The distance between the workpiece and the deposition source can be adjusted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.