Ceramic multilayer circuit board and semiconductor module
US4821142A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1987 |
| Grant date | Apr 11, 1989 |
| Priority date | — |
| Expiry date | Jun 4, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4916
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic multilayer circuit board comprising ceramic layers and wiring conductor layers laminated alternately, in which the ceramic layer has a thermal expansion coefficient lower than that of the wiring conductor and not lower than one half of that of the conductor layer and is formed from a glass which softens at a temperature not higher than the melting point of the wiring conductor layer; a semiconductor module having a high reliability in its solder joint part comprising said ceramic multilayer circuit board mounted with a ceramic carrier substrate being mounted with a semiconductor device, said board being able to use a silver or copper conductor having a good electro-conductivity; and an amorphous glass powder for said ceramic multilayer circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.