Released film structures and method of measuring film properties
US4823607A · kind A · utility
28Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 1987 |
| Grant date | Apr 25, 1989 |
| Priority date | — |
| Expiry date | May 18, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0647
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Released film structures are employed in measuring the mechanical properties of the film material. By measuring the deformation of thin film structures held under intrinsic tensile stress and then released, these mechanical properties can be accurately measured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.