Method for anisotropically hardening a protective coating for integrated circuit manufacture
US4826754A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 27, 1987 |
| Grant date | May 2, 1989 |
| Priority date | — |
| Expiry date | Apr 27, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/949
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for anisotropically hardening a protective coating to provide a well defined edge thereon for forming features which may be smaller than the resolution limit of the exposure equipment for the purpose of integrated circuit manufacture is disclosed. The method includes the steps of forming a non-planar coating on a substrate with a photoresist material having a sensitivity to incident flux that varies as a function of the angle of the incidence of the flux upon the coating. The coating is anisotropically hardened by exposing it to flux to which it has a relatively high sensitivity so that portions for which the flux is incident at one angle are more hardened than those portions where the flux is incident at a different angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.