Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
US4827327A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 1988 |
| Grant date | May 2, 1989 |
| Priority date | — |
| Expiry date | Jul 5, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device including a stacked layer unit having a plurality of stacked layers each having an insulation layer and at least one conductive layer strip formed on a surface of the insulation layer, and at least one chip mounted on the top of the insulation layer and having a plurality of circuit elements. The IC device also includes at least one first conductive member formed in the stacked layer unit, having a low inductance for first signals applied thereto and operatively connecting the first signals to be transferred between the circuit elements. The IC device further includes at least one second conductive member formed in the stacked layer unit, having a higher inductance for the first signals than that of the first conductive member and operatively connecting second signals to be transferred between the circuit elements the stacked layer unit, the chip, and the first and second conductive members are enclosed by a package and sealed with a hermetic seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.