Polyimide formulation for forming a patterned film on a substrate
US4828964A · kind A · utility
3Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1987 |
| Grant date | May 9, 1989 |
| Priority date | — |
| Expiry date | Sep 4, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/091
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A composition for use in a process for the deposition of patterned thin metal films on integrated circuit substrates, the composition comprising an admixture of a thermoplastic polyimide resin and a coumarin dye dissolved in a substituted phenol solvent. Optionally a polar solvent having a boiling point greater than 160.degree. C. and a low boiling organic compound (70.degree.-150.degree. C.) may be incorporated in the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.