Process for producing high-density wiring board
US4830691A · kind A · utility
31Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1987 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Mar 31, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board comprising (A) a base substrate on which the necessary wiring pattern has already been formed, and (B) a multi-layer substrate bonded to the wiring pattern side of said base substrate (A) and comprising heat-resistant resin layers and thin-film wiring patterns formed by a thin film forming method under vacuum can mount LSI chips on the substrate and realize increased density of signal wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.