Akinari Kida
9Patents
8h-index
30Co-inventors
65Inventor score
Filing activity: Mar 31, 1987 → Oct 5, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6268648A | Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device | Electricity | 47 | Expired |
| US5690837A | Process for producing multilayer printed circuit board | Electricity | 38 | Expired |
| US4830691A | Process for producing high-density wiring board | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5638598A | Process for producing a printed wiring board | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5689879A | Metal foil for printed wiring board and production thereof | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6492203B1 | Semiconductor device and method of fabrication thereof | Electricity | 20 | Expired |
| US5403672A | Metal foil for printed wiring board and production thereof | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5444189A | Printed wiring board and production thereof | Electricity | 9 | Expired |
| US5885723A | Bonding film for printed circuit boards | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.