Processing apparatus for wafers
US4832778A · kind A · utility
28Cited by
20References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1988 |
| Grant date | May 23, 1989 |
| Priority date | — |
| Expiry date | May 27, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high pressure processing apparatus and method which is compatible with a system wherein wafers are largely transported and processed under vacuum. The pressure vessel can be extremely small, i.e. has a total pressurized volume of which almost all interior points are within one or two centimeters of one of the workpieces which may be loaded into the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.