Electroless copper plating solution and process for electrolessly plating copper
US4834796A · kind A · utility
13Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1987 |
| Grant date | May 30, 1989 |
| Priority date | — |
| Expiry date | Nov 5, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A practically fast electroless copper deposition is obtained by using a trialkanolmonoamine as a complexing agent for copper ion and as an accelerator, by adding it in an excess amount of 1.2 to 30 times the mole concentration of the copper ion. An optimum increased deposition rate of 100 .mu.m/hr is obtained even if additives such as potassium ferrocyanide, 2,2'-bipyridyl, polyethylenegrycol and an anionic surfactant are added.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.