Adaptive lithography system to provide high density interconnect
US4835704A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1986 |
| Grant date | May 30, 1989 |
| Priority date | — |
| Expiry date | Dec 29, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adaptive method and system are disclosed for providing high density interconnections of very large scale integrated circuits on a substrate. The procedure is performed in four basic steps: first an artwork representation for the interconnections of the integrated circuits is generated. This artwork representation is stored in a computer data base and assumes the integrated circuits to be at predetermined ideal locations and positions on the substrate. Second, using imaging, the actual positions of each integrated circuit on the substrate are determined. The actual positions of the integrated circuits are compared with their ideal positions to compute an offset and rotation for each integrated circuit on the substrate. Third, the computed offsets and rotations are then used to modify the artwork representation stored in the data base to account for the actual locations and positions of the integrated circuits on the substrate. Finally, the modified artwork representation is used to drive a direct writing laser lithography system that actually forms the high density interconnections of the integrated circuits on the substrate. The artwork representations are stored in computer dat…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.