Robert J. Wojnarowski
145Patents
58h-index
113Co-inventors
93Inventor score
Filing activity: Aug 13, 1979 → Feb 4, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5353498A | Method for fabricating an integrated circuit module | Emerging Cross-Sectional Technologies | 844 | Expired |
| US5241456A | Compact high density interconnect structure | Electricity | 380 | Expired |
| US4783695A | Multichip integrated circuit packaging configuration and method | Electricity | 379 | Expired |
| US4290052A | Capacitive touch entry apparatus having high degree of personal safety | Electricity | 236 | Expired |
| US5527741A | Fabrication and structures of circuit modules with flexible interconnect layers | Emerging Cross-Sectional Technologies | 227 | Expired |
| US5324687A | Method for thinning of integrated circuit chips for lightweight packaged electronic systems | Emerging Cross-Sectional Technologies | 209 | Expired |
| US5888884A | Electronic device pad relocation, precision placement, and packaging in arrays | Electricity | 188 | Expired |
| US4918811A | Multichip integrated circuit packaging method | Emerging Cross-Sectional Technologies | 170 | Expired |
| US5434751A | Reworkable high density interconnect structure incorporating a release layer | Emerging Cross-Sectional Technologies | 168 | Expired |
| US4894115A | Laser beam scanning method for forming via holes in polymer materials | Electricity | 167 | Expired |
| US5703400A | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Emerging Cross-Sectional Technologies | 163 | Expired |
| US5353195A | Integral power and ground structure for multi-chip modules | Electricity | 160 | Expired |
| US6635363B1 | Phosphor coating with self-adjusting distance from LED chip | Emerging Cross-Sectional Technologies | 158 | Expired |
| US5161093A | Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive | Electricity | 157 | Expired |
| US5546654A | Vacuum fixture and method for fabricating electronic assemblies | Emerging Cross-Sectional Technologies | 152 | Expired |
| US6412971B1 | Light source including an array of light emitting semiconductor devices and control method | Emerging Cross-Sectional Technologies | 148 | Expired |
| US5866952A | High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate | Electricity | 143 | Expired |
| US4835704A | Adaptive lithography system to provide high density interconnect | Emerging Cross-Sectional Technologies | 138 | Expired |
| US6242282A | Circuit chip package and fabrication method | Electricity | 130 | Expired |
| US6635987B1 | High power white LED lamp structure using unique phosphor application for LED lighting products | Electricity | 129 | Expired |
| US6452217B1 | High power LED lamp structure using phase change cooling enhancements for LED lighting products | Electricity | 126 | Expired |
| US6396153B2 | Circuit chip package and fabrication method | Electricity | 123 | Expired |
| US5900674A | Interface structures for electronic devices | Emerging Cross-Sectional Technologies | 123 | Expired |
| US5422513A | Integrated circuit chip placement in a high density interconnect structure | Electricity | 118 | Expired |
| US5366906A | Wafer level integration and testing | Electricity | 116 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.