Photocurable laminate
US4839261A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1987 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | Sep 15, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/033
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process for forming electroless copper plating patterns comprising: (a) laminating a substrate with a photocurable laminate, (b) exposing said photocurable laminate to a high energy ray, (c) removing unexposed parts of the laminate, and (d) electrolessly plating a desired pat of the laminate with copper; wherein said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] ##STR1## and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula EQU --(R.sub.4).sub.n wherein R.sub.4 is a group having a double bond and n is an integer of 1 to 50 and characterized by a viscosity at 20.degree. C. of from 0.001 to 500 poises.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.